Surface State
Good smoothness/flatness with less porosity due to fine particles.
Excellent in adhesion with thick/thin film materials.
Thermal Characteristics
Physical/chemical characteristics are stable even under a hot environment.
Excellent in thermal shock resistance.
High thermal conductivity and coefficient of thermal expansion similar to that of silicon.
Warp
Minimal warpage, bending, and undulation.
Dimensional Accuracy
Less variance in outline,plate thickness, slit pitch, etc.
Mechanical Characteristics
High mechanical strength and excellent resistance against oil and chemical.
Electrical Characteristics
Excellent in insulation properties, high dielectric breakdwon voltage,
high surface resistivity/volume resistivity, and small dielectric constant.
Breakage
Stable breaking strength, and less variance in shape/dimension.
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